RF PCB design is often considered one of the more challenging aspects of electronics engineering due to the high frequencies involved and the sensitivity of signal integrity. In this presentation, Max Kendall, WØMXX, will dive into the core principles that underpin effective and reliable RF board design. He will explore the importance of using a 4-layer PCB stackup, which allows for better isolation, dedicated ground and power planes, and improved signal performance.
Topics will include the role of copper pours in managing return paths and minimizing interference, as well as how to achieve proper impedance matching for critical RF components and transmission lines. Max will also walk through best practices for feedline routing, highlighting techniques for minimizing signal loss, avoiding crosstalk, and ensuring consistent characteristic impedance throughout the board.